JPS5710748U - - Google Patents

Info

Publication number
JPS5710748U
JPS5710748U JP1980084227U JP8422780U JPS5710748U JP S5710748 U JPS5710748 U JP S5710748U JP 1980084227 U JP1980084227 U JP 1980084227U JP 8422780 U JP8422780 U JP 8422780U JP S5710748 U JPS5710748 U JP S5710748U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1980084227U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980084227U priority Critical patent/JPS5710748U/ja
Publication of JPS5710748U publication Critical patent/JPS5710748U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07602—Connecting or disconnecting of strap connectors using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07652—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/621—Structures or relative sizes of strap connectors
    • H10W72/627—Multiple strap connectors having different structures or shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/641—Dispositions of strap connectors
    • H10W72/646—Dispositions of strap connectors the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Thyristors (AREA)
  • Wire Bonding (AREA)
JP1980084227U 1980-06-18 1980-06-18 Pending JPS5710748U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980084227U JPS5710748U (enExample) 1980-06-18 1980-06-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980084227U JPS5710748U (enExample) 1980-06-18 1980-06-18

Publications (1)

Publication Number Publication Date
JPS5710748U true JPS5710748U (enExample) 1982-01-20

Family

ID=29446531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980084227U Pending JPS5710748U (enExample) 1980-06-18 1980-06-18

Country Status (1)

Country Link
JP (1) JPS5710748U (enExample)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6014270U (ja) * 1983-07-08 1985-01-30 本田技研工業株式会社 内燃機関用エアクリーナの蒸発燃料吸着装置
JPS6014269U (ja) * 1983-07-08 1985-01-30 本田技研工業株式会社 エアクリ−ナの蒸発燃料吸着装置
JPS6150635A (ja) * 1984-08-13 1986-03-12 リンデ　アクチエンゲゼルシャフト 吸着器
JPS6193934U (enExample) * 1984-11-24 1986-06-17
JPS63101413U (enExample) * 1986-11-20 1988-07-01
JPH01170415U (enExample) * 1989-01-13 1989-12-01
JP2007095984A (ja) * 2005-09-29 2007-04-12 Hitachi Ltd 半導体モジュール
EP1898465A2 (en) * 2006-09-11 2008-03-12 Hitachi, Ltd. Power semiconductor module
JP2012146998A (ja) * 2012-03-12 2012-08-02 Renesas Electronics Corp 半導体装置
WO2013054408A1 (ja) * 2011-10-12 2013-04-18 日本碍子株式会社 大容量モジュールの周辺回路用の回路基板、及び当該回路基板を用いる周辺回路を含む大容量モジュール
JP2013206942A (ja) * 2012-03-27 2013-10-07 Sharp Corp 半導体装置
JP2018190767A (ja) * 2017-04-28 2018-11-29 株式会社オートネットワーク技術研究所 回路基板と回路部品とを備えた回路装置、該回路装置の製造方法
DE102017221961B4 (de) 2017-03-02 2023-12-21 Mitsubishi Electric Corporation Halbleiterleistungsmodul und leistungsumrichtervorrichtung
JPWO2024143541A1 (enExample) * 2022-12-28 2024-07-04

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6014270U (ja) * 1983-07-08 1985-01-30 本田技研工業株式会社 内燃機関用エアクリーナの蒸発燃料吸着装置
JPS6014269U (ja) * 1983-07-08 1985-01-30 本田技研工業株式会社 エアクリ−ナの蒸発燃料吸着装置
JPS6150635A (ja) * 1984-08-13 1986-03-12 リンデ　アクチエンゲゼルシャフト 吸着器
JPS6193934U (enExample) * 1984-11-24 1986-06-17
JPS63101413U (enExample) * 1986-11-20 1988-07-01
JPH01170415U (enExample) * 1989-01-13 1989-12-01
JP2007095984A (ja) * 2005-09-29 2007-04-12 Hitachi Ltd 半導体モジュール
EP1898465A2 (en) * 2006-09-11 2008-03-12 Hitachi, Ltd. Power semiconductor module
WO2013054408A1 (ja) * 2011-10-12 2013-04-18 日本碍子株式会社 大容量モジュールの周辺回路用の回路基板、及び当該回路基板を用いる周辺回路を含む大容量モジュール
US9064758B2 (en) 2011-10-12 2015-06-23 Ngk Insulators, Ltd. High-capacity module including the peripheral circuit using the circuit board and the circuit board concerned for peripheral circuits of a high-capacity module
JP2012146998A (ja) * 2012-03-12 2012-08-02 Renesas Electronics Corp 半導体装置
JP2013206942A (ja) * 2012-03-27 2013-10-07 Sharp Corp 半導体装置
DE102017221961B4 (de) 2017-03-02 2023-12-21 Mitsubishi Electric Corporation Halbleiterleistungsmodul und leistungsumrichtervorrichtung
JP2018190767A (ja) * 2017-04-28 2018-11-29 株式会社オートネットワーク技術研究所 回路基板と回路部品とを備えた回路装置、該回路装置の製造方法
JPWO2024143541A1 (enExample) * 2022-12-28 2024-07-04

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