JPS5710748U - - Google Patents
Info
- Publication number
- JPS5710748U JPS5710748U JP1980084227U JP8422780U JPS5710748U JP S5710748 U JPS5710748 U JP S5710748U JP 1980084227 U JP1980084227 U JP 1980084227U JP 8422780 U JP8422780 U JP 8422780U JP S5710748 U JPS5710748 U JP S5710748U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/076—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H10W72/07602—
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- H10W72/07652—
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- H10W72/07653—
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- H10W72/60—
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- H10W72/627—
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- H10W72/646—
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- H10W72/926—
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- H10W90/763—
Landscapes
- Thyristors (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980084227U JPS5710748U (cg-RX-API-DMAC10.html) | 1980-06-18 | 1980-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980084227U JPS5710748U (cg-RX-API-DMAC10.html) | 1980-06-18 | 1980-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5710748U true JPS5710748U (cg-RX-API-DMAC10.html) | 1982-01-20 |
Family
ID=29446531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980084227U Pending JPS5710748U (cg-RX-API-DMAC10.html) | 1980-06-18 | 1980-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5710748U (cg-RX-API-DMAC10.html) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6014269U (ja) * | 1983-07-08 | 1985-01-30 | 本田技研工業株式会社 | エアクリ−ナの蒸発燃料吸着装置 |
| JPS6014270U (ja) * | 1983-07-08 | 1985-01-30 | 本田技研工業株式会社 | 内燃機関用エアクリーナの蒸発燃料吸着装置 |
| JPS6150635A (ja) * | 1984-08-13 | 1986-03-12 | リンデ アクチエンゲゼルシャフト | 吸着器 |
| JPS6193934U (cg-RX-API-DMAC10.html) * | 1984-11-24 | 1986-06-17 | ||
| JPS63101413U (cg-RX-API-DMAC10.html) * | 1986-11-20 | 1988-07-01 | ||
| JPH01170415U (cg-RX-API-DMAC10.html) * | 1989-01-13 | 1989-12-01 | ||
| JP2007095984A (ja) * | 2005-09-29 | 2007-04-12 | Hitachi Ltd | 半導体モジュール |
| EP1898465A2 (en) * | 2006-09-11 | 2008-03-12 | Hitachi, Ltd. | Power semiconductor module |
| JP2012146998A (ja) * | 2012-03-12 | 2012-08-02 | Renesas Electronics Corp | 半導体装置 |
| WO2013054408A1 (ja) * | 2011-10-12 | 2013-04-18 | 日本碍子株式会社 | 大容量モジュールの周辺回路用の回路基板、及び当該回路基板を用いる周辺回路を含む大容量モジュール |
| JP2013206942A (ja) * | 2012-03-27 | 2013-10-07 | Sharp Corp | 半導体装置 |
| JP2018190767A (ja) * | 2017-04-28 | 2018-11-29 | 株式会社オートネットワーク技術研究所 | 回路基板と回路部品とを備えた回路装置、該回路装置の製造方法 |
| DE102017221961B4 (de) | 2017-03-02 | 2023-12-21 | Mitsubishi Electric Corporation | Halbleiterleistungsmodul und leistungsumrichtervorrichtung |
| JPWO2024143541A1 (cg-RX-API-DMAC10.html) * | 2022-12-28 | 2024-07-04 |
-
1980
- 1980-06-18 JP JP1980084227U patent/JPS5710748U/ja active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6014269U (ja) * | 1983-07-08 | 1985-01-30 | 本田技研工業株式会社 | エアクリ−ナの蒸発燃料吸着装置 |
| JPS6014270U (ja) * | 1983-07-08 | 1985-01-30 | 本田技研工業株式会社 | 内燃機関用エアクリーナの蒸発燃料吸着装置 |
| JPS6150635A (ja) * | 1984-08-13 | 1986-03-12 | リンデ アクチエンゲゼルシャフト | 吸着器 |
| JPS6193934U (cg-RX-API-DMAC10.html) * | 1984-11-24 | 1986-06-17 | ||
| JPS63101413U (cg-RX-API-DMAC10.html) * | 1986-11-20 | 1988-07-01 | ||
| JPH01170415U (cg-RX-API-DMAC10.html) * | 1989-01-13 | 1989-12-01 | ||
| JP2007095984A (ja) * | 2005-09-29 | 2007-04-12 | Hitachi Ltd | 半導体モジュール |
| EP1898465A2 (en) * | 2006-09-11 | 2008-03-12 | Hitachi, Ltd. | Power semiconductor module |
| WO2013054408A1 (ja) * | 2011-10-12 | 2013-04-18 | 日本碍子株式会社 | 大容量モジュールの周辺回路用の回路基板、及び当該回路基板を用いる周辺回路を含む大容量モジュール |
| US9064758B2 (en) | 2011-10-12 | 2015-06-23 | Ngk Insulators, Ltd. | High-capacity module including the peripheral circuit using the circuit board and the circuit board concerned for peripheral circuits of a high-capacity module |
| JP2012146998A (ja) * | 2012-03-12 | 2012-08-02 | Renesas Electronics Corp | 半導体装置 |
| JP2013206942A (ja) * | 2012-03-27 | 2013-10-07 | Sharp Corp | 半導体装置 |
| DE102017221961B4 (de) | 2017-03-02 | 2023-12-21 | Mitsubishi Electric Corporation | Halbleiterleistungsmodul und leistungsumrichtervorrichtung |
| JP2018190767A (ja) * | 2017-04-28 | 2018-11-29 | 株式会社オートネットワーク技術研究所 | 回路基板と回路部品とを備えた回路装置、該回路装置の製造方法 |
| JPWO2024143541A1 (cg-RX-API-DMAC10.html) * | 2022-12-28 | 2024-07-04 |