JPS5710742U - - Google Patents

Info

Publication number
JPS5710742U
JPS5710742U JP1980086233U JP8623380U JPS5710742U JP S5710742 U JPS5710742 U JP S5710742U JP 1980086233 U JP1980086233 U JP 1980086233U JP 8623380 U JP8623380 U JP 8623380U JP S5710742 U JPS5710742 U JP S5710742U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1980086233U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980086233U priority Critical patent/JPS5710742U/ja
Priority to US06/263,275 priority patent/US4417267A/en
Publication of JPS5710742U publication Critical patent/JPS5710742U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1980086233U 1980-06-18 1980-06-18 Pending JPS5710742U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1980086233U JPS5710742U (ja) 1980-06-18 1980-06-18
US06/263,275 US4417267A (en) 1980-06-18 1981-05-13 Cooling means for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980086233U JPS5710742U (ja) 1980-06-18 1980-06-18

Publications (1)

Publication Number Publication Date
JPS5710742U true JPS5710742U (ja) 1982-01-20

Family

ID=13881067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980086233U Pending JPS5710742U (ja) 1980-06-18 1980-06-18

Country Status (2)

Country Link
US (1) US4417267A (ja)
JP (1) JPS5710742U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60165012U (ja) * 1984-04-11 1985-11-01 立石　直樹 濾過装置
JPS62118920A (ja) * 1985-11-19 1987-05-30 Mitsubishi Cable Ind Ltd アルミニウム板の加工方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546409A (en) * 1982-04-02 1985-10-08 Mitsubishi Denki Kabushiki Kaisha Device for cooling semiconductor elements
GB8522159D0 (en) * 1985-09-06 1985-10-09 Lucas Elect Electron Syst Connection of electrical component
US4970579A (en) * 1988-09-21 1990-11-13 International Business Machines Corp. Integrated circuit package with improved cooling means
US7455029B2 (en) * 2004-01-13 2008-11-25 Basement Systems, Inc. Condensation-collecting element and method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices
US3187812A (en) * 1963-02-11 1965-06-08 Staver Co Heat dissipator for electronic circuitry
US3434018A (en) * 1966-07-05 1969-03-18 Motorola Inc Heat conductive mounting base for a semiconductor device
US3396361A (en) * 1966-12-05 1968-08-06 Solitron Devices Combined mounting support, heat sink, and electrical terminal connection assembly
US3930115A (en) * 1971-05-19 1975-12-30 Philips Corp Electric component assembly comprising insulating foil bearing conductor tracks
US4196444A (en) * 1976-12-03 1980-04-01 Texas Instruments Deutschland Gmbh Encapsulated power semiconductor device with single piece heat sink mounting plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60165012U (ja) * 1984-04-11 1985-11-01 立石　直樹 濾過装置
JPS62118920A (ja) * 1985-11-19 1987-05-30 Mitsubishi Cable Ind Ltd アルミニウム板の加工方法

Also Published As

Publication number Publication date
US4417267A (en) 1983-11-22

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