JPS569043A - Method and device for molding shell mold - Google Patents
Method and device for molding shell moldInfo
- Publication number
- JPS569043A JPS569043A JP8351279A JP8351279A JPS569043A JP S569043 A JPS569043 A JP S569043A JP 8351279 A JP8351279 A JP 8351279A JP 8351279 A JP8351279 A JP 8351279A JP S569043 A JPS569043 A JP S569043A
- Authority
- JP
- Japan
- Prior art keywords
- blown
- base
- nozzle
- mold
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To form a uniform coat film by blowing a powder binder and a base material independently to the surface of a metal mold in an electrostatically charged state.
CONSTITUTION: Three holes are pierced longitudinally into, for example, a nozzle base 6, and conductive earth rings 10 are fitted to the central part. Corona discharge pins 12 are provided to the inside walls of the respective holes 9 and the nozzle base 6 is connected to an electric power source 13. A metal die 2 is placed on a table 3 and is preheated to a predetermined temperature, thence a parting agent 26 is blown thereto. While passing a conveyor 8 suspending the nozzle base 6 over the metal die 2, a binder 27 is charged by the base nozzle 6 discharged from a feeder 16 and is then blown to the metal die 2 by way of a pipe 22. Similarly, a base material 28 and an adhesive agent 29 are blown. Thereby, a uniform coat film is made. Next, a shell sand discharging device 25 passes over the metal mold 2 to back up shell sand 30. The shell sand is sintered by the heat retained in the metal mold 2 and the sintered shell mold 31 is taken out.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8351279A JPS569043A (en) | 1979-07-03 | 1979-07-03 | Method and device for molding shell mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8351279A JPS569043A (en) | 1979-07-03 | 1979-07-03 | Method and device for molding shell mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS569043A true JPS569043A (en) | 1981-01-29 |
JPS6242703B2 JPS6242703B2 (en) | 1987-09-09 |
Family
ID=13804530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8351279A Granted JPS569043A (en) | 1979-07-03 | 1979-07-03 | Method and device for molding shell mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS569043A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6383292B1 (en) | 1998-09-02 | 2002-05-07 | Micron Technology, Inc. | Semiconductor device encapsulators |
JP2007515980A (en) * | 2003-06-25 | 2007-06-21 | フォウカス ファーマスーティカルズ リミティド | Capsule shell manufacturing method and capsule |
-
1979
- 1979-07-03 JP JP8351279A patent/JPS569043A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6383292B1 (en) | 1998-09-02 | 2002-05-07 | Micron Technology, Inc. | Semiconductor device encapsulators |
US6399425B1 (en) * | 1998-09-02 | 2002-06-04 | Micron Technology, Inc. | Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices |
US6812068B2 (en) | 1998-09-02 | 2004-11-02 | Micron Technology, Inc. | Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packages |
JP2007515980A (en) * | 2003-06-25 | 2007-06-21 | フォウカス ファーマスーティカルズ リミティド | Capsule shell manufacturing method and capsule |
Also Published As
Publication number | Publication date |
---|---|
JPS6242703B2 (en) | 1987-09-09 |
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