JPS5688474A - Ink composition for coating flexible circuit board - Google Patents
Ink composition for coating flexible circuit boardInfo
- Publication number
- JPS5688474A JPS5688474A JP16553679A JP16553679A JPS5688474A JP S5688474 A JPS5688474 A JP S5688474A JP 16553679 A JP16553679 A JP 16553679A JP 16553679 A JP16553679 A JP 16553679A JP S5688474 A JPS5688474 A JP S5688474A
- Authority
- JP
- Japan
- Prior art keywords
- ink composition
- groups
- circuit board
- flexible circuit
- polyene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 6
- 239000000377 silicon dioxide Substances 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 2
- 230000002209 hydrophobic effect Effects 0.000 abstract 2
- 150000004291 polyenes Chemical class 0.000 abstract 2
- 125000003396 thiol group Chemical group [H]S* 0.000 abstract 2
- PSYGHMBJXWRQFD-UHFFFAOYSA-N 2-(2-sulfanylacetyl)oxyethyl 2-sulfanylacetate Chemical compound SCC(=O)OCCOC(=O)CS PSYGHMBJXWRQFD-UHFFFAOYSA-N 0.000 abstract 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 abstract 1
- 239000000049 pigment Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 125000005372 silanol group Chemical group 0.000 abstract 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16553679A JPS5688474A (en) | 1979-12-21 | 1979-12-21 | Ink composition for coating flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16553679A JPS5688474A (en) | 1979-12-21 | 1979-12-21 | Ink composition for coating flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5688474A true JPS5688474A (en) | 1981-07-17 |
| JPS6147183B2 JPS6147183B2 (enExample) | 1986-10-17 |
Family
ID=15814244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16553679A Granted JPS5688474A (en) | 1979-12-21 | 1979-12-21 | Ink composition for coating flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5688474A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007321028A (ja) * | 2006-05-31 | 2007-12-13 | Showa Denko Kk | レジストインキ組成物及び該レジストインキ組成物を用いたエッチング方法 |
-
1979
- 1979-12-21 JP JP16553679A patent/JPS5688474A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007321028A (ja) * | 2006-05-31 | 2007-12-13 | Showa Denko Kk | レジストインキ組成物及び該レジストインキ組成物を用いたエッチング方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6147183B2 (enExample) | 1986-10-17 |
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