JPS568499B2 - - Google Patents

Info

Publication number
JPS568499B2
JPS568499B2 JP6604773A JP6604773A JPS568499B2 JP S568499 B2 JPS568499 B2 JP S568499B2 JP 6604773 A JP6604773 A JP 6604773A JP 6604773 A JP6604773 A JP 6604773A JP S568499 B2 JPS568499 B2 JP S568499B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6604773A
Other languages
Japanese (ja)
Other versions
JPS5013877A (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6604773A priority Critical patent/JPS568499B2/ja
Publication of JPS5013877A publication Critical patent/JPS5013877A/ja
Publication of JPS568499B2 publication Critical patent/JPS568499B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP6604773A 1973-06-12 1973-06-12 Expired JPS568499B2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6604773A JPS568499B2 (fr) 1973-06-12 1973-06-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6604773A JPS568499B2 (fr) 1973-06-12 1973-06-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP56179481A Division JPS57202747A (en) 1981-11-09 1981-11-09 Electronic circuit device

Publications (2)

Publication Number Publication Date
JPS5013877A JPS5013877A (fr) 1975-02-13
JPS568499B2 true JPS568499B2 (fr) 1981-02-24

Family

ID=13304557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6604773A Expired JPS568499B2 (fr) 1973-06-12 1973-06-12

Country Status (1)

Country Link
JP (1) JPS568499B2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5225571A (en) * 1975-08-22 1977-02-25 Hitachi Ltd Semiconductor device
JPS54167667U (fr) * 1978-05-15 1979-11-26
JPS54158169A (en) * 1978-06-02 1979-12-13 Nec Corp Semiconductor device
JPS5712747U (fr) * 1980-06-25 1982-01-22
JP4952233B2 (ja) * 2006-04-19 2012-06-13 日亜化学工業株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49100566A (fr) * 1973-01-30 1974-09-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49100566A (fr) * 1973-01-30 1974-09-24

Also Published As

Publication number Publication date
JPS5013877A (fr) 1975-02-13

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