JPS568499B2 - - Google Patents
Info
- Publication number
- JPS568499B2 JPS568499B2 JP6604773A JP6604773A JPS568499B2 JP S568499 B2 JPS568499 B2 JP S568499B2 JP 6604773 A JP6604773 A JP 6604773A JP 6604773 A JP6604773 A JP 6604773A JP S568499 B2 JPS568499 B2 JP S568499B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6604773A JPS568499B2 (enrdf_load_stackoverflow) | 1973-06-12 | 1973-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6604773A JPS568499B2 (enrdf_load_stackoverflow) | 1973-06-12 | 1973-06-12 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56179481A Division JPS57202747A (en) | 1981-11-09 | 1981-11-09 | Electronic circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5013877A JPS5013877A (enrdf_load_stackoverflow) | 1975-02-13 |
| JPS568499B2 true JPS568499B2 (enrdf_load_stackoverflow) | 1981-02-24 |
Family
ID=13304557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6604773A Expired JPS568499B2 (enrdf_load_stackoverflow) | 1973-06-12 | 1973-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS568499B2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5225571A (en) * | 1975-08-22 | 1977-02-25 | Hitachi Ltd | Semiconductor device |
| JPS54167667U (enrdf_load_stackoverflow) * | 1978-05-15 | 1979-11-26 | ||
| JPS54158169A (en) * | 1978-06-02 | 1979-12-13 | Nec Corp | Semiconductor device |
| JPS5712747U (enrdf_load_stackoverflow) * | 1980-06-25 | 1982-01-22 | ||
| JP4952233B2 (ja) * | 2006-04-19 | 2012-06-13 | 日亜化学工業株式会社 | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5548700B2 (enrdf_load_stackoverflow) * | 1973-01-30 | 1980-12-08 |
-
1973
- 1973-06-12 JP JP6604773A patent/JPS568499B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5013877A (enrdf_load_stackoverflow) | 1975-02-13 |