JPS5678356A - Manufacture of commutator - Google Patents
Manufacture of commutatorInfo
- Publication number
- JPS5678356A JPS5678356A JP15783680A JP15783680A JPS5678356A JP S5678356 A JPS5678356 A JP S5678356A JP 15783680 A JP15783680 A JP 15783680A JP 15783680 A JP15783680 A JP 15783680A JP S5678356 A JPS5678356 A JP S5678356A
- Authority
- JP
- Japan
- Prior art keywords
- boss
- insulator
- powdery material
- layer
- powdery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/06—Manufacture of commutators
Abstract
PURPOSE:To easily form the layer in very short time for the subject commutator by a method wherein an insulator layer is provided on the outer circumference of a boss by applying a powdery material coating method. CONSTITUTION:A cleaning solution such as trichlene or the like is applied on the outer circumference of the boss 1 and its surface is cleaned. Then the surfaces where no powdery insulator is allowed to be adhered to, for instance, such as the surfaces on both ends of the boss and the inner surface of the boss hole, are masked by sticking a silicon adhesive tape on the surfaces and then the boss is preheated at the proper temperature, for example at approximately 220 deg.C, so that the insulator will be fused speedily and deposited on the boss. A filter 7 is installed at the lower section of the container 6 of a powdery material coating vessel, on which powdery material 9 of powdery material insulator is placed, the powdery material 9 is wafted by sending air from an air inlet 8 located at the lower section of the container, the preheated boss 1 is hung down using a wire 10 and an insulator layer is formed on the outer circumferential surface of the boss. Hence the layer can be formed easily in a very short time.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15783680A JPS5678356A (en) | 1980-11-10 | 1980-11-10 | Manufacture of commutator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15783680A JPS5678356A (en) | 1980-11-10 | 1980-11-10 | Manufacture of commutator |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5678356A true JPS5678356A (en) | 1981-06-27 |
JPS5733676B2 JPS5733676B2 (en) | 1982-07-19 |
Family
ID=15658392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15783680A Granted JPS5678356A (en) | 1980-11-10 | 1980-11-10 | Manufacture of commutator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5678356A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6369446A (en) * | 1986-09-09 | 1988-03-29 | Makita Denki Seisakusho:Kk | Commutator |
US5973406A (en) * | 1996-08-26 | 1999-10-26 | Hitachi, Ltd. | Electronic device bonding method and electronic circuit apparatus |
US6227436B1 (en) | 1990-02-19 | 2001-05-08 | Hitachi, Ltd. | Method of fabricating an electronic circuit device and apparatus for performing the method |
US6471115B1 (en) | 1990-02-19 | 2002-10-29 | Hitachi, Ltd. | Process for manufacturing electronic circuit devices |
-
1980
- 1980-11-10 JP JP15783680A patent/JPS5678356A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6369446A (en) * | 1986-09-09 | 1988-03-29 | Makita Denki Seisakusho:Kk | Commutator |
US6227436B1 (en) | 1990-02-19 | 2001-05-08 | Hitachi, Ltd. | Method of fabricating an electronic circuit device and apparatus for performing the method |
US6471115B1 (en) | 1990-02-19 | 2002-10-29 | Hitachi, Ltd. | Process for manufacturing electronic circuit devices |
US5973406A (en) * | 1996-08-26 | 1999-10-26 | Hitachi, Ltd. | Electronic device bonding method and electronic circuit apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS5733676B2 (en) | 1982-07-19 |
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