JPS5678288U - - Google Patents

Info

Publication number
JPS5678288U
JPS5678288U JP1979155507U JP15550779U JPS5678288U JP S5678288 U JPS5678288 U JP S5678288U JP 1979155507 U JP1979155507 U JP 1979155507U JP 15550779 U JP15550779 U JP 15550779U JP S5678288 U JPS5678288 U JP S5678288U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1979155507U
Other languages
Japanese (ja)
Other versions
JPS6350864Y2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979155507U priority Critical patent/JPS6350864Y2/ja
Publication of JPS5678288U publication Critical patent/JPS5678288U/ja
Application granted granted Critical
Publication of JPS6350864Y2 publication Critical patent/JPS6350864Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1979155507U 1979-11-08 1979-11-08 Expired JPS6350864Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979155507U JPS6350864Y2 (en:Method) 1979-11-08 1979-11-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979155507U JPS6350864Y2 (en:Method) 1979-11-08 1979-11-08

Publications (2)

Publication Number Publication Date
JPS5678288U true JPS5678288U (en:Method) 1981-06-25
JPS6350864Y2 JPS6350864Y2 (en:Method) 1988-12-27

Family

ID=29667373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979155507U Expired JPS6350864Y2 (en:Method) 1979-11-08 1979-11-08

Country Status (1)

Country Link
JP (1) JPS6350864Y2 (en:Method)

Also Published As

Publication number Publication date
JPS6350864Y2 (en:Method) 1988-12-27

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