JPS5676552A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS5676552A
JPS5676552A JP15293579A JP15293579A JPS5676552A JP S5676552 A JPS5676552 A JP S5676552A JP 15293579 A JP15293579 A JP 15293579A JP 15293579 A JP15293579 A JP 15293579A JP S5676552 A JPS5676552 A JP S5676552A
Authority
JP
Japan
Prior art keywords
resin
compared
epoxy resin
sealer
green
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15293579A
Other languages
Japanese (ja)
Inventor
Isao Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15293579A priority Critical patent/JPS5676552A/en
Publication of JPS5676552A publication Critical patent/JPS5676552A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54473Marks applied to semiconductor devices or parts for use after dicing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To stabilize the identification of resin-sealed semiconductor devices by using as a sealer with resin mold a mixture of epoxy resin and silicone resin together with identifying coloring agent added to it, thereby preventing variation in color tone. CONSTITUTION:Phthalocyan green as green, phthalocyan blue as blue, permanent red as red and iron oxide as brown and so forth are mixed as coloring agents in a mixture containing, for example 50% of epoxy resin and 50% of silicone resin as resin sealer of transistor or the like. Thus, there can be obtained resin which is inexpensive as compared with the resin containing mainly silicone resin, which incorporates less discoloring property as compared with epoxy resin and excellent moisture resistance, and which is simple and is not erased in its identification marking as compared with the conventional system wherein the mark is printed on the package.
JP15293579A 1979-11-28 1979-11-28 Resin-sealed semiconductor device Pending JPS5676552A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15293579A JPS5676552A (en) 1979-11-28 1979-11-28 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15293579A JPS5676552A (en) 1979-11-28 1979-11-28 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5676552A true JPS5676552A (en) 1981-06-24

Family

ID=15551353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15293579A Pending JPS5676552A (en) 1979-11-28 1979-11-28 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5676552A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50132867A (en) * 1974-04-05 1975-10-21
JPS5539257A (en) * 1978-09-12 1980-03-19 Mitsubishi Electric Corp Removing method of malodor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50132867A (en) * 1974-04-05 1975-10-21
JPS5539257A (en) * 1978-09-12 1980-03-19 Mitsubishi Electric Corp Removing method of malodor

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