JPS5670646U - - Google Patents
Info
- Publication number
- JPS5670646U JPS5670646U JP14118480U JP14118480U JPS5670646U JP S5670646 U JPS5670646 U JP S5670646U JP 14118480 U JP14118480 U JP 14118480U JP 14118480 U JP14118480 U JP 14118480U JP S5670646 U JPS5670646 U JP S5670646U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14118480U JPS5670646U (ko) | 1980-10-03 | 1980-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14118480U JPS5670646U (ko) | 1980-10-03 | 1980-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5670646U true JPS5670646U (ko) | 1981-06-11 |
Family
ID=29372517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14118480U Pending JPS5670646U (ko) | 1980-10-03 | 1980-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5670646U (ko) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5226187A (en) * | 1975-08-22 | 1977-02-26 | Hitachi Ltd | Semiconductor unit |
-
1980
- 1980-10-03 JP JP14118480U patent/JPS5670646U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5226187A (en) * | 1975-08-22 | 1977-02-26 | Hitachi Ltd | Semiconductor unit |