JPS5666092A - Device for precisely positioning printed board - Google Patents
Device for precisely positioning printed boardInfo
- Publication number
- JPS5666092A JPS5666092A JP14131579A JP14131579A JPS5666092A JP S5666092 A JPS5666092 A JP S5666092A JP 14131579 A JP14131579 A JP 14131579A JP 14131579 A JP14131579 A JP 14131579A JP S5666092 A JPS5666092 A JP S5666092A
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- precisely positioning
- positioning printed
- precisely
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14131579A JPS5666092A (en) | 1979-11-02 | 1979-11-02 | Device for precisely positioning printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14131579A JPS5666092A (en) | 1979-11-02 | 1979-11-02 | Device for precisely positioning printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5666092A true JPS5666092A (en) | 1981-06-04 |
Family
ID=15289039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14131579A Pending JPS5666092A (en) | 1979-11-02 | 1979-11-02 | Device for precisely positioning printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5666092A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS604293A (en) * | 1983-06-22 | 1985-01-10 | 株式会社日立製作所 | Laminating device |
JPS62127240A (en) * | 1985-11-28 | 1987-06-09 | 富士通株式会社 | Method of laminating and positioning green sheet |
JPS62158395A (en) * | 1985-12-28 | 1987-07-14 | シチズン時計株式会社 | Method of setting origin of coordinates in electronic parts automatic inserter |
JPH02156600A (en) * | 1988-12-09 | 1990-06-15 | Fujitsu Ltd | Device for correcting position of automatic parts inserting device for printed circuit board |
US5123823A (en) * | 1990-02-01 | 1992-06-23 | Mitsubishi Denki Kabushiki Kaisha | Molding device for sealing semiconductor element with resin |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS498166A (en) * | 1972-05-10 | 1974-01-24 | ||
JPS5350055U (en) * | 1976-10-01 | 1978-04-27 | ||
JPS53116476A (en) * | 1977-03-23 | 1978-10-11 | Sanyo Electric Co | Device for inspecting printed board or like already mounted with part |
-
1979
- 1979-11-02 JP JP14131579A patent/JPS5666092A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS498166A (en) * | 1972-05-10 | 1974-01-24 | ||
JPS5350055U (en) * | 1976-10-01 | 1978-04-27 | ||
JPS53116476A (en) * | 1977-03-23 | 1978-10-11 | Sanyo Electric Co | Device for inspecting printed board or like already mounted with part |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS604293A (en) * | 1983-06-22 | 1985-01-10 | 株式会社日立製作所 | Laminating device |
JPH0478038B2 (en) * | 1983-06-22 | 1992-12-10 | Hitachi Ltd | |
JPS62127240A (en) * | 1985-11-28 | 1987-06-09 | 富士通株式会社 | Method of laminating and positioning green sheet |
JPS62158395A (en) * | 1985-12-28 | 1987-07-14 | シチズン時計株式会社 | Method of setting origin of coordinates in electronic parts automatic inserter |
JPH02156600A (en) * | 1988-12-09 | 1990-06-15 | Fujitsu Ltd | Device for correcting position of automatic parts inserting device for printed circuit board |
US5123823A (en) * | 1990-02-01 | 1992-06-23 | Mitsubishi Denki Kabushiki Kaisha | Molding device for sealing semiconductor element with resin |
US5288698A (en) * | 1990-02-01 | 1994-02-22 | Mitsubishi Denki Kabushiki Kaisha | Method of positioning lead frame on molding die to seal semiconductor element with resin |
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