JPS566557B2 - - Google Patents

Info

Publication number
JPS566557B2
JPS566557B2 JP2618773A JP2618773A JPS566557B2 JP S566557 B2 JPS566557 B2 JP S566557B2 JP 2618773 A JP2618773 A JP 2618773A JP 2618773 A JP2618773 A JP 2618773A JP S566557 B2 JPS566557 B2 JP S566557B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2618773A
Other languages
Japanese (ja)
Other versions
JPS49115699A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2618773A priority Critical patent/JPS566557B2/ja
Publication of JPS49115699A publication Critical patent/JPS49115699A/ja
Publication of JPS566557B2 publication Critical patent/JPS566557B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Led Device Packages (AREA)
  • Audible And Visible Signals (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2618773A 1973-03-07 1973-03-07 Expired JPS566557B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2618773A JPS566557B2 (enrdf_load_stackoverflow) 1973-03-07 1973-03-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2618773A JPS566557B2 (enrdf_load_stackoverflow) 1973-03-07 1973-03-07

Publications (2)

Publication Number Publication Date
JPS49115699A JPS49115699A (enrdf_load_stackoverflow) 1974-11-05
JPS566557B2 true JPS566557B2 (enrdf_load_stackoverflow) 1981-02-12

Family

ID=12186489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2618773A Expired JPS566557B2 (enrdf_load_stackoverflow) 1973-03-07 1973-03-07

Country Status (1)

Country Link
JP (1) JPS566557B2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187152A (en) * 1981-05-02 1982-11-17 Zatsuku Shiyutorangugiisutehin Straightly arranging device in combination with carrying of continuous casting machine
JPS5982152A (ja) * 1982-11-02 1984-05-12 Sumitomo Heavy Ind Ltd 連続鋳造機の鋳片支持装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5335427Y2 (enrdf_load_stackoverflow) * 1972-10-30 1978-08-30

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187152A (en) * 1981-05-02 1982-11-17 Zatsuku Shiyutorangugiisutehin Straightly arranging device in combination with carrying of continuous casting machine
JPS5982152A (ja) * 1982-11-02 1984-05-12 Sumitomo Heavy Ind Ltd 連続鋳造機の鋳片支持装置

Also Published As

Publication number Publication date
JPS49115699A (enrdf_load_stackoverflow) 1974-11-05

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