JPS565631A - Endoscope - Google Patents
EndoscopeInfo
- Publication number
- JPS565631A JPS565631A JP8216079A JP8216079A JPS565631A JP S565631 A JPS565631 A JP S565631A JP 8216079 A JP8216079 A JP 8216079A JP 8216079 A JP8216079 A JP 8216079A JP S565631 A JPS565631 A JP S565631A
- Authority
- JP
- Japan
- Prior art keywords
- endoscope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Endoscopes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8216079A JPS565631A (en) | 1979-06-29 | 1979-06-29 | Endoscope |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8216079A JPS565631A (en) | 1979-06-29 | 1979-06-29 | Endoscope |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS565631A true JPS565631A (en) | 1981-01-21 |
Family
ID=13766670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8216079A Pending JPS565631A (en) | 1979-06-29 | 1979-06-29 | Endoscope |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS565631A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60203329A (ja) * | 1984-03-29 | 1985-10-14 | Tsuchiya Mfg Co Ltd | 多板式熱交換器の製造方法 |
US8003036B2 (en) | 2005-07-13 | 2011-08-23 | Seoul Semiconductor Co., Ltd. | Mold for forming a molding member and method of fabricating a molding member using the same |
-
1979
- 1979-06-29 JP JP8216079A patent/JPS565631A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60203329A (ja) * | 1984-03-29 | 1985-10-14 | Tsuchiya Mfg Co Ltd | 多板式熱交換器の製造方法 |
JPH055579B2 (ja) * | 1984-03-29 | 1993-01-22 | Tsucha Seisakusho Kk | |
US8003036B2 (en) | 2005-07-13 | 2011-08-23 | Seoul Semiconductor Co., Ltd. | Mold for forming a molding member and method of fabricating a molding member using the same |
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