JPS5655725Y2 - - Google Patents

Info

Publication number
JPS5655725Y2
JPS5655725Y2 JP1976156270U JP15627076U JPS5655725Y2 JP S5655725 Y2 JPS5655725 Y2 JP S5655725Y2 JP 1976156270 U JP1976156270 U JP 1976156270U JP 15627076 U JP15627076 U JP 15627076U JP S5655725 Y2 JPS5655725 Y2 JP S5655725Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976156270U
Other languages
Japanese (ja)
Other versions
JPS5373888U (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976156270U priority Critical patent/JPS5655725Y2/ja
Publication of JPS5373888U publication Critical patent/JPS5373888U/ja
Application granted granted Critical
Publication of JPS5655725Y2 publication Critical patent/JPS5655725Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP1976156270U 1976-11-19 1976-11-19 Expired JPS5655725Y2 (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976156270U JPS5655725Y2 (cg-RX-API-DMAC10.html) 1976-11-19 1976-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976156270U JPS5655725Y2 (cg-RX-API-DMAC10.html) 1976-11-19 1976-11-19

Publications (2)

Publication Number Publication Date
JPS5373888U JPS5373888U (cg-RX-API-DMAC10.html) 1978-06-20
JPS5655725Y2 true JPS5655725Y2 (cg-RX-API-DMAC10.html) 1981-12-25

Family

ID=28764360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976156270U Expired JPS5655725Y2 (cg-RX-API-DMAC10.html) 1976-11-19 1976-11-19

Country Status (1)

Country Link
JP (1) JPS5655725Y2 (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4590994B2 (ja) * 2004-09-09 2010-12-01 豊田合成株式会社 発光装置およびその製造方法
US7842526B2 (en) 2004-09-09 2010-11-30 Toyoda Gosei Co., Ltd. Light emitting device and method of producing same
JP6432656B2 (ja) * 2017-08-22 2018-12-05 日亜化学工業株式会社 発光装置
JP7054005B2 (ja) * 2018-09-28 2022-04-13 日亜化学工業株式会社 発光装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014378U (cg-RX-API-DMAC10.html) * 1973-06-06 1975-02-14
JPS5531590Y2 (cg-RX-API-DMAC10.html) * 1974-06-04 1980-07-28

Also Published As

Publication number Publication date
JPS5373888U (cg-RX-API-DMAC10.html) 1978-06-20

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