JPS5653551Y2 - - Google Patents

Info

Publication number
JPS5653551Y2
JPS5653551Y2 JP1976074491U JP7449176U JPS5653551Y2 JP S5653551 Y2 JPS5653551 Y2 JP S5653551Y2 JP 1976074491 U JP1976074491 U JP 1976074491U JP 7449176 U JP7449176 U JP 7449176U JP S5653551 Y2 JPS5653551 Y2 JP S5653551Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976074491U
Other languages
Japanese (ja)
Other versions
JPS52164451U (xx
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976074491U priority Critical patent/JPS5653551Y2/ja
Publication of JPS52164451U publication Critical patent/JPS52164451U/ja
Application granted granted Critical
Publication of JPS5653551Y2 publication Critical patent/JPS5653551Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1976074491U 1976-06-08 1976-06-08 Expired JPS5653551Y2 (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976074491U JPS5653551Y2 (xx) 1976-06-08 1976-06-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976074491U JPS5653551Y2 (xx) 1976-06-08 1976-06-08

Publications (2)

Publication Number Publication Date
JPS52164451U JPS52164451U (xx) 1977-12-13
JPS5653551Y2 true JPS5653551Y2 (xx) 1981-12-14

Family

ID=28547718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976074491U Expired JPS5653551Y2 (xx) 1976-06-08 1976-06-08

Country Status (1)

Country Link
JP (1) JPS5653551Y2 (xx)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5066170A (xx) * 1973-10-12 1975-06-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5066170A (xx) * 1973-10-12 1975-06-04

Also Published As

Publication number Publication date
JPS52164451U (xx) 1977-12-13

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