JPS565314Y2 - - Google Patents
Info
- Publication number
- JPS565314Y2 JPS565314Y2 JP1976043349U JP4334976U JPS565314Y2 JP S565314 Y2 JPS565314 Y2 JP S565314Y2 JP 1976043349 U JP1976043349 U JP 1976043349U JP 4334976 U JP4334976 U JP 4334976U JP S565314 Y2 JPS565314 Y2 JP S565314Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976043349U JPS565314Y2 (en:Method) | 1976-04-07 | 1976-04-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976043349U JPS565314Y2 (en:Method) | 1976-04-07 | 1976-04-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52135065U JPS52135065U (en:Method) | 1977-10-14 |
| JPS565314Y2 true JPS565314Y2 (en:Method) | 1981-02-05 |
Family
ID=28502417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976043349U Expired JPS565314Y2 (en:Method) | 1976-04-07 | 1976-04-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS565314Y2 (en:Method) |
-
1976
- 1976-04-07 JP JP1976043349U patent/JPS565314Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52135065U (en:Method) | 1977-10-14 |