JPS5649186B2 - - Google Patents

Info

Publication number
JPS5649186B2
JPS5649186B2 JP15596676A JP15596676A JPS5649186B2 JP S5649186 B2 JPS5649186 B2 JP S5649186B2 JP 15596676 A JP15596676 A JP 15596676A JP 15596676 A JP15596676 A JP 15596676A JP S5649186 B2 JPS5649186 B2 JP S5649186B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15596676A
Other languages
Japanese (ja)
Other versions
JPS5378956A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15596676A priority Critical patent/JPS5378956A/en
Publication of JPS5378956A publication Critical patent/JPS5378956A/en
Publication of JPS5649186B2 publication Critical patent/JPS5649186B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
JP15596676A 1976-12-23 1976-12-23 Soldering method of two elements Granted JPS5378956A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15596676A JPS5378956A (en) 1976-12-23 1976-12-23 Soldering method of two elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15596676A JPS5378956A (en) 1976-12-23 1976-12-23 Soldering method of two elements

Publications (2)

Publication Number Publication Date
JPS5378956A JPS5378956A (en) 1978-07-12
JPS5649186B2 true JPS5649186B2 (en) 1981-11-20

Family

ID=15617421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15596676A Granted JPS5378956A (en) 1976-12-23 1976-12-23 Soldering method of two elements

Country Status (1)

Country Link
JP (1) JPS5378956A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0239876B2 (en) * 1983-10-27 1990-09-07 Fujitsu Ltd
US11008436B2 (en) 2017-03-16 2021-05-18 Lyten, Inc. Carbon and elastomer integration

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2793737B2 (en) * 1992-03-18 1998-09-03 株式会社トクヤマ Manufacturing method of precoated substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4822772B1 (en) * 1970-05-15 1973-07-09

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240382Y2 (en) * 1971-07-23 1977-09-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4822772B1 (en) * 1970-05-15 1973-07-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0239876B2 (en) * 1983-10-27 1990-09-07 Fujitsu Ltd
US11008436B2 (en) 2017-03-16 2021-05-18 Lyten, Inc. Carbon and elastomer integration

Also Published As

Publication number Publication date
JPS5378956A (en) 1978-07-12

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