JPS5648968B2 - - Google Patents
Info
- Publication number
- JPS5648968B2 JPS5648968B2 JP11388172A JP11388172A JPS5648968B2 JP S5648968 B2 JPS5648968 B2 JP S5648968B2 JP 11388172 A JP11388172 A JP 11388172A JP 11388172 A JP11388172 A JP 11388172A JP S5648968 B2 JPS5648968 B2 JP S5648968B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
Landscapes
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11388172A JPS5648968B2 (https=) | 1972-11-15 | 1972-11-15 | |
| DE19732356856 DE2356856C3 (de) | 1972-11-15 | 1973-11-14 | Epoxyharz-Zubereitung und Verfahren zum Schützen von elektronischen Bauteilen unter Verwendung der Zubereitung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11388172A JPS5648968B2 (https=) | 1972-11-15 | 1972-11-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4971457A JPS4971457A (https=) | 1974-07-10 |
| JPS5648968B2 true JPS5648968B2 (https=) | 1981-11-19 |
Family
ID=14623446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11388172A Expired JPS5648968B2 (https=) | 1972-11-15 | 1972-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5648968B2 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6252570U (https=) * | 1985-09-21 | 1987-04-01 | ||
| JPS6282881U (https=) * | 1985-11-14 | 1987-05-27 | ||
| JPS6445587U (https=) * | 1987-09-16 | 1989-03-20 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4872246A (https=) * | 1971-11-01 | 1973-09-29 |
-
1972
- 1972-11-15 JP JP11388172A patent/JPS5648968B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6252570U (https=) * | 1985-09-21 | 1987-04-01 | ||
| JPS6282881U (https=) * | 1985-11-14 | 1987-05-27 | ||
| JPS6445587U (https=) * | 1987-09-16 | 1989-03-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2356856B2 (de) | 1976-07-29 |
| JPS4971457A (https=) | 1974-07-10 |
| DE2356856A1 (de) | 1974-05-22 |