JPS5648968B2 - - Google Patents

Info

Publication number
JPS5648968B2
JPS5648968B2 JP11388172A JP11388172A JPS5648968B2 JP S5648968 B2 JPS5648968 B2 JP S5648968B2 JP 11388172 A JP11388172 A JP 11388172A JP 11388172 A JP11388172 A JP 11388172A JP S5648968 B2 JPS5648968 B2 JP S5648968B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11388172A
Other languages
Japanese (ja)
Other versions
JPS4971457A (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11388172A priority Critical patent/JPS5648968B2/ja
Priority to DE19732356856 priority patent/DE2356856C3/de
Publication of JPS4971457A publication Critical patent/JPS4971457A/ja
Publication of JPS5648968B2 publication Critical patent/JPS5648968B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP11388172A 1972-11-15 1972-11-15 Expired JPS5648968B2 (OSRAM)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11388172A JPS5648968B2 (OSRAM) 1972-11-15 1972-11-15
DE19732356856 DE2356856C3 (de) 1972-11-15 1973-11-14 Epoxyharz-Zubereitung und Verfahren zum Schützen von elektronischen Bauteilen unter Verwendung der Zubereitung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11388172A JPS5648968B2 (OSRAM) 1972-11-15 1972-11-15

Publications (2)

Publication Number Publication Date
JPS4971457A JPS4971457A (OSRAM) 1974-07-10
JPS5648968B2 true JPS5648968B2 (OSRAM) 1981-11-19

Family

ID=14623446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11388172A Expired JPS5648968B2 (OSRAM) 1972-11-15 1972-11-15

Country Status (1)

Country Link
JP (1) JPS5648968B2 (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252570U (OSRAM) * 1985-09-21 1987-04-01
JPS6282881U (OSRAM) * 1985-11-14 1987-05-27
JPS6445587U (OSRAM) * 1987-09-16 1989-03-20

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4872246A (OSRAM) * 1971-11-01 1973-09-29

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252570U (OSRAM) * 1985-09-21 1987-04-01
JPS6282881U (OSRAM) * 1985-11-14 1987-05-27
JPS6445587U (OSRAM) * 1987-09-16 1989-03-20

Also Published As

Publication number Publication date
JPS4971457A (OSRAM) 1974-07-10
DE2356856B2 (de) 1976-07-29
DE2356856A1 (de) 1974-05-22

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