JPS5647957Y2 - - Google Patents
Info
- Publication number
- JPS5647957Y2 JPS5647957Y2 JP1977089021U JP8902177U JPS5647957Y2 JP S5647957 Y2 JPS5647957 Y2 JP S5647957Y2 JP 1977089021 U JP1977089021 U JP 1977089021U JP 8902177 U JP8902177 U JP 8902177U JP S5647957 Y2 JPS5647957 Y2 JP S5647957Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977089021U JPS5647957Y2 (en, 2012) | 1977-07-05 | 1977-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977089021U JPS5647957Y2 (en, 2012) | 1977-07-05 | 1977-07-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5415256U JPS5415256U (en, 2012) | 1979-01-31 |
| JPS5647957Y2 true JPS5647957Y2 (en, 2012) | 1981-11-10 |
Family
ID=29016045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977089021U Expired JPS5647957Y2 (en, 2012) | 1977-07-05 | 1977-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5647957Y2 (en, 2012) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010015618A (ja) * | 2008-07-01 | 2010-01-21 | Nitto Denko Corp | 回路付サスペンション基板およびその製造方法 |
| JP6392676B2 (ja) * | 2015-01-30 | 2018-09-19 | シチズンファインデバイス株式会社 | 電子部品のワイヤー接続構造 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4837356U (en, 2012) * | 1971-09-08 | 1973-05-07 |
-
1977
- 1977-07-05 JP JP1977089021U patent/JPS5647957Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5415256U (en, 2012) | 1979-01-31 |