JPS5647952Y2 - - Google Patents
Info
- Publication number
- JPS5647952Y2 JPS5647952Y2 JP1975137099U JP13709975U JPS5647952Y2 JP S5647952 Y2 JPS5647952 Y2 JP S5647952Y2 JP 1975137099 U JP1975137099 U JP 1975137099U JP 13709975 U JP13709975 U JP 13709975U JP S5647952 Y2 JPS5647952 Y2 JP S5647952Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975137099U JPS5647952Y2 (https=) | 1975-10-07 | 1975-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975137099U JPS5647952Y2 (https=) | 1975-10-07 | 1975-10-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5250060U JPS5250060U (https=) | 1977-04-09 |
| JPS5647952Y2 true JPS5647952Y2 (https=) | 1981-11-10 |
Family
ID=28617063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975137099U Expired JPS5647952Y2 (https=) | 1975-10-07 | 1975-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5647952Y2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120781Y2 (https=) * | 1980-06-13 | 1986-06-21 |
-
1975
- 1975-10-07 JP JP1975137099U patent/JPS5647952Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5250060U (https=) | 1977-04-09 |