JPS5644034Y2 - - Google Patents

Info

Publication number
JPS5644034Y2
JPS5644034Y2 JP1976003663U JP366376U JPS5644034Y2 JP S5644034 Y2 JPS5644034 Y2 JP S5644034Y2 JP 1976003663 U JP1976003663 U JP 1976003663U JP 366376 U JP366376 U JP 366376U JP S5644034 Y2 JPS5644034 Y2 JP S5644034Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976003663U
Other languages
Japanese (ja)
Other versions
JPS5297063U (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976003663U priority Critical patent/JPS5644034Y2/ja
Publication of JPS5297063U publication Critical patent/JPS5297063U/ja
Application granted granted Critical
Publication of JPS5644034Y2 publication Critical patent/JPS5644034Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1976003663U 1976-01-17 1976-01-17 Expired JPS5644034Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976003663U JPS5644034Y2 (en:Method) 1976-01-17 1976-01-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976003663U JPS5644034Y2 (en:Method) 1976-01-17 1976-01-17

Publications (2)

Publication Number Publication Date
JPS5297063U JPS5297063U (en:Method) 1977-07-20
JPS5644034Y2 true JPS5644034Y2 (en:Method) 1981-10-15

Family

ID=28464324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976003663U Expired JPS5644034Y2 (en:Method) 1976-01-17 1976-01-17

Country Status (1)

Country Link
JP (1) JPS5644034Y2 (en:Method)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5324209Y2 (en:Method) * 1972-11-10 1978-06-21
JPS5249642Y2 (en:Method) * 1973-04-27 1977-11-11
JPS5621264B2 (en:Method) * 1973-11-14 1981-05-18

Also Published As

Publication number Publication date
JPS5297063U (en:Method) 1977-07-20

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