JPS5643355A - Thermosetting resin - Google Patents

Thermosetting resin

Info

Publication number
JPS5643355A
JPS5643355A JP12035979A JP12035979A JPS5643355A JP S5643355 A JPS5643355 A JP S5643355A JP 12035979 A JP12035979 A JP 12035979A JP 12035979 A JP12035979 A JP 12035979A JP S5643355 A JPS5643355 A JP S5643355A
Authority
JP
Japan
Prior art keywords
resin
thermosetting resin
precondensate
filler
molding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12035979A
Other languages
Japanese (ja)
Inventor
Genichi Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP12035979A priority Critical patent/JPS5643355A/en
Publication of JPS5643355A publication Critical patent/JPS5643355A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To provide a thermosetting resin of which the adhesiveness with a grinder, the mutual adhesiveness of ground products and the dispersibility of ground products are improved, by adding a filler for a molding material to a precondensate of a thermosetting resin and molding the obtained mixture into a solid state.
CONSTITUTION: A filter for a molding material is added to a precondensate of a thermosetting resin and the obtained mixture is molded into a solid state. A mixing ratio of the precondensate of the thermosetting resin and the filler for the molding material is pref. regulated so as to include the filler in an amount of 20W80wt% against the total mixture. If the adding amount thereof is below 20wt%, the adhesiveness becomes higher and, if the adding amount thereof exceeds 80wt%, the dispersibility is lowered. As the precondensate of the thermosetting resin, a phenol resin, a urea resin, a melamine resin, a xylene resin, an unsaturated polyester resin and modified resins thereof are designated. As the filler for the molding material, a wood powder or a clay is pref. used against a phenol resin, a pulp or an asphalt against a urea resin and calcium carbonate or silica against an unsaturated polyester resin.
COPYRIGHT: (C)1981,JPO&Japio
JP12035979A 1979-09-18 1979-09-18 Thermosetting resin Pending JPS5643355A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12035979A JPS5643355A (en) 1979-09-18 1979-09-18 Thermosetting resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12035979A JPS5643355A (en) 1979-09-18 1979-09-18 Thermosetting resin

Publications (1)

Publication Number Publication Date
JPS5643355A true JPS5643355A (en) 1981-04-22

Family

ID=14784244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12035979A Pending JPS5643355A (en) 1979-09-18 1979-09-18 Thermosetting resin

Country Status (1)

Country Link
JP (1) JPS5643355A (en)

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