JPS5643012Y2 - - Google Patents

Info

Publication number
JPS5643012Y2
JPS5643012Y2 JP2362077U JP2362077U JPS5643012Y2 JP S5643012 Y2 JPS5643012 Y2 JP S5643012Y2 JP 2362077 U JP2362077 U JP 2362077U JP 2362077 U JP2362077 U JP 2362077U JP S5643012 Y2 JPS5643012 Y2 JP S5643012Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2362077U
Other languages
Japanese (ja)
Other versions
JPS53118470U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2362077U priority Critical patent/JPS5643012Y2/ja
Publication of JPS53118470U publication Critical patent/JPS53118470U/ja
Application granted granted Critical
Publication of JPS5643012Y2 publication Critical patent/JPS5643012Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
JP2362077U 1977-02-28 1977-02-28 Expired JPS5643012Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2362077U JPS5643012Y2 (en) 1977-02-28 1977-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2362077U JPS5643012Y2 (en) 1977-02-28 1977-02-28

Publications (2)

Publication Number Publication Date
JPS53118470U JPS53118470U (en) 1978-09-20
JPS5643012Y2 true JPS5643012Y2 (en) 1981-10-08

Family

ID=28860562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2362077U Expired JPS5643012Y2 (en) 1977-02-28 1977-02-28

Country Status (1)

Country Link
JP (1) JPS5643012Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069188B2 (en) * 1985-04-30 1994-02-02 住友電気工業株式会社 Compound semiconductor substrate

Also Published As

Publication number Publication date
JPS53118470U (en) 1978-09-20

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