JPS5642139B2 - - Google Patents
Info
- Publication number
- JPS5642139B2 JPS5642139B2 JP13108176A JP13108176A JPS5642139B2 JP S5642139 B2 JPS5642139 B2 JP S5642139B2 JP 13108176 A JP13108176 A JP 13108176A JP 13108176 A JP13108176 A JP 13108176A JP S5642139 B2 JPS5642139 B2 JP S5642139B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13108176A JPS5355960A (en) | 1976-10-29 | 1976-10-29 | Breaking method for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13108176A JPS5355960A (en) | 1976-10-29 | 1976-10-29 | Breaking method for semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5355960A JPS5355960A (en) | 1978-05-20 |
| JPS5642139B2 true JPS5642139B2 (no) | 1981-10-02 |
Family
ID=15049536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13108176A Granted JPS5355960A (en) | 1976-10-29 | 1976-10-29 | Breaking method for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5355960A (no) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6383044U (no) * | 1986-10-01 | 1988-05-31 |
-
1976
- 1976-10-29 JP JP13108176A patent/JPS5355960A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6383044U (no) * | 1986-10-01 | 1988-05-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5355960A (en) | 1978-05-20 |