JPS5637699A - Device for separating and recovering solder for printed board - Google Patents
Device for separating and recovering solder for printed boardInfo
- Publication number
- JPS5637699A JPS5637699A JP11277779A JP11277779A JPS5637699A JP S5637699 A JPS5637699 A JP S5637699A JP 11277779 A JP11277779 A JP 11277779A JP 11277779 A JP11277779 A JP 11277779A JP S5637699 A JPS5637699 A JP S5637699A
- Authority
- JP
- Japan
- Prior art keywords
- separating
- printed board
- recovering solder
- solder
- recovering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11277779A JPS5637699A (en) | 1979-09-05 | 1979-09-05 | Device for separating and recovering solder for printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11277779A JPS5637699A (en) | 1979-09-05 | 1979-09-05 | Device for separating and recovering solder for printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5637699A true JPS5637699A (en) | 1981-04-11 |
Family
ID=14595231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11277779A Pending JPS5637699A (en) | 1979-09-05 | 1979-09-05 | Device for separating and recovering solder for printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5637699A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08139446A (en) * | 1994-11-08 | 1996-05-31 | Nec Corp | Part disassembling method from part mounted printed-board |
JPH08148823A (en) * | 1994-11-16 | 1996-06-07 | Senju Metal Ind Co Ltd | Method for recovering valuable material from printed board and its equipment |
JP2015018858A (en) * | 2013-07-09 | 2015-01-29 | 富士電機株式会社 | Electronic component separation apparatus of printed circuit board |
JP2018123358A (en) * | 2017-01-30 | 2018-08-09 | 株式会社アステック入江 | Metal recovery method |
JP2018123356A (en) * | 2017-01-30 | 2018-08-09 | 株式会社アステック入江 | Metal recovery method |
-
1979
- 1979-09-05 JP JP11277779A patent/JPS5637699A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08139446A (en) * | 1994-11-08 | 1996-05-31 | Nec Corp | Part disassembling method from part mounted printed-board |
JPH08148823A (en) * | 1994-11-16 | 1996-06-07 | Senju Metal Ind Co Ltd | Method for recovering valuable material from printed board and its equipment |
JP2015018858A (en) * | 2013-07-09 | 2015-01-29 | 富士電機株式会社 | Electronic component separation apparatus of printed circuit board |
JP2018123358A (en) * | 2017-01-30 | 2018-08-09 | 株式会社アステック入江 | Metal recovery method |
JP2018123356A (en) * | 2017-01-30 | 2018-08-09 | 株式会社アステック入江 | Metal recovery method |
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