JPS5635025B2 - - Google Patents
Info
- Publication number
- JPS5635025B2 JPS5635025B2 JP8734371A JP8734371A JPS5635025B2 JP S5635025 B2 JPS5635025 B2 JP S5635025B2 JP 8734371 A JP8734371 A JP 8734371A JP 8734371 A JP8734371 A JP 8734371A JP S5635025 B2 JPS5635025 B2 JP S5635025B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8734371A JPS5635025B2 (de) | 1971-11-02 | 1971-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8734371A JPS5635025B2 (de) | 1971-11-02 | 1971-11-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4852374A JPS4852374A (de) | 1973-07-23 |
| JPS5635025B2 true JPS5635025B2 (de) | 1981-08-14 |
Family
ID=13912208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8734371A Expired JPS5635025B2 (de) | 1971-11-02 | 1971-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5635025B2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010016392A (ja) * | 2001-10-01 | 2010-01-21 | Xsil Technology Ltd | 基板、特に半導体ウェハの加工 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53123657A (en) * | 1977-04-04 | 1978-10-28 | Nec Corp | Production of semiconductor unit |
| JP4439990B2 (ja) * | 2004-04-28 | 2010-03-24 | 株式会社ディスコ | レーザー加工方法 |
-
1971
- 1971-11-02 JP JP8734371A patent/JPS5635025B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010016392A (ja) * | 2001-10-01 | 2010-01-21 | Xsil Technology Ltd | 基板、特に半導体ウェハの加工 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4852374A (de) | 1973-07-23 |