JPS5635022B2 - - Google Patents

Info

Publication number
JPS5635022B2
JPS5635022B2 JP10016973A JP10016973A JPS5635022B2 JP S5635022 B2 JPS5635022 B2 JP S5635022B2 JP 10016973 A JP10016973 A JP 10016973A JP 10016973 A JP10016973 A JP 10016973A JP S5635022 B2 JPS5635022 B2 JP S5635022B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10016973A
Other languages
Japanese (ja)
Other versions
JPS5052974A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10016973A priority Critical patent/JPS5635022B2/ja
Publication of JPS5052974A publication Critical patent/JPS5052974A/ja
Publication of JPS5635022B2 publication Critical patent/JPS5635022B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Jigs For Machine Tools (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP10016973A 1973-09-07 1973-09-07 Expired JPS5635022B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10016973A JPS5635022B2 (enrdf_load_stackoverflow) 1973-09-07 1973-09-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10016973A JPS5635022B2 (enrdf_load_stackoverflow) 1973-09-07 1973-09-07

Publications (2)

Publication Number Publication Date
JPS5052974A JPS5052974A (enrdf_load_stackoverflow) 1975-05-10
JPS5635022B2 true JPS5635022B2 (enrdf_load_stackoverflow) 1981-08-14

Family

ID=14266804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10016973A Expired JPS5635022B2 (enrdf_load_stackoverflow) 1973-09-07 1973-09-07

Country Status (1)

Country Link
JP (1) JPS5635022B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6037843U (ja) * 1983-08-23 1985-03-15 株式会社村田製作所 音叉振動子を用いた荷重検出装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59132640A (ja) * 1983-01-20 1984-07-30 Nec Corp 半導体素子用リ−ドフレ−ム
JPH0351073Y2 (enrdf_load_stackoverflow) * 1986-06-30 1991-10-31
JPH0681636B2 (ja) * 1988-12-28 1994-10-19 株式会社貝印刃物開発センター 鋏における刀身の取付構造
JPH0310722A (ja) * 1989-06-08 1991-01-18 Zexel Corp プリント基板の位置決め装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6037843U (ja) * 1983-08-23 1985-03-15 株式会社村田製作所 音叉振動子を用いた荷重検出装置

Also Published As

Publication number Publication date
JPS5052974A (enrdf_load_stackoverflow) 1975-05-10

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