JPS5635022B2 - - Google Patents
Info
- Publication number
- JPS5635022B2 JPS5635022B2 JP10016973A JP10016973A JPS5635022B2 JP S5635022 B2 JPS5635022 B2 JP S5635022B2 JP 10016973 A JP10016973 A JP 10016973A JP 10016973 A JP10016973 A JP 10016973A JP S5635022 B2 JPS5635022 B2 JP S5635022B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Jigs For Machine Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10016973A JPS5635022B2 (cs) | 1973-09-07 | 1973-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10016973A JPS5635022B2 (cs) | 1973-09-07 | 1973-09-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5052974A JPS5052974A (cs) | 1975-05-10 |
| JPS5635022B2 true JPS5635022B2 (cs) | 1981-08-14 |
Family
ID=14266804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10016973A Expired JPS5635022B2 (cs) | 1973-09-07 | 1973-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5635022B2 (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6037843U (ja) * | 1983-08-23 | 1985-03-15 | 株式会社村田製作所 | 音叉振動子を用いた荷重検出装置 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59132640A (ja) * | 1983-01-20 | 1984-07-30 | Nec Corp | 半導体素子用リ−ドフレ−ム |
| JPH0351073Y2 (cs) * | 1986-06-30 | 1991-10-31 | ||
| JPH0681636B2 (ja) * | 1988-12-28 | 1994-10-19 | 株式会社貝印刃物開発センター | 鋏における刀身の取付構造 |
| JPH0310722A (ja) * | 1989-06-08 | 1991-01-18 | Zexel Corp | プリント基板の位置決め装置 |
-
1973
- 1973-09-07 JP JP10016973A patent/JPS5635022B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6037843U (ja) * | 1983-08-23 | 1985-03-15 | 株式会社村田製作所 | 音叉振動子を用いた荷重検出装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5052974A (cs) | 1975-05-10 |