JPS5632450U - - Google Patents
Info
- Publication number
- JPS5632450U JPS5632450U JP11331879U JP11331879U JPS5632450U JP S5632450 U JPS5632450 U JP S5632450U JP 11331879 U JP11331879 U JP 11331879U JP 11331879 U JP11331879 U JP 11331879U JP S5632450 U JPS5632450 U JP S5632450U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11331879U JPS607494Y2 (en) | 1979-08-16 | 1979-08-16 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11331879U JPS607494Y2 (en) | 1979-08-16 | 1979-08-16 | semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5632450U true JPS5632450U (en) | 1981-03-30 |
| JPS607494Y2 JPS607494Y2 (en) | 1985-03-13 |
Family
ID=29345613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11331879U Expired JPS607494Y2 (en) | 1979-08-16 | 1979-08-16 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS607494Y2 (en) |
-
1979
- 1979-08-16 JP JP11331879U patent/JPS607494Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS607494Y2 (en) | 1985-03-13 |