JPS5631874Y2 - - Google Patents

Info

Publication number
JPS5631874Y2
JPS5631874Y2 JP1976023496U JP2349676U JPS5631874Y2 JP S5631874 Y2 JPS5631874 Y2 JP S5631874Y2 JP 1976023496 U JP1976023496 U JP 1976023496U JP 2349676 U JP2349676 U JP 2349676U JP S5631874 Y2 JPS5631874 Y2 JP S5631874Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976023496U
Other languages
Japanese (ja)
Other versions
JPS52116161U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976023496U priority Critical patent/JPS5631874Y2/ja
Publication of JPS52116161U publication Critical patent/JPS52116161U/ja
Application granted granted Critical
Publication of JPS5631874Y2 publication Critical patent/JPS5631874Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1976023496U 1976-02-27 1976-02-27 Expired JPS5631874Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976023496U JPS5631874Y2 (enrdf_load_stackoverflow) 1976-02-27 1976-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976023496U JPS5631874Y2 (enrdf_load_stackoverflow) 1976-02-27 1976-02-27

Publications (2)

Publication Number Publication Date
JPS52116161U JPS52116161U (enrdf_load_stackoverflow) 1977-09-03
JPS5631874Y2 true JPS5631874Y2 (enrdf_load_stackoverflow) 1981-07-29

Family

ID=28483417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976023496U Expired JPS5631874Y2 (enrdf_load_stackoverflow) 1976-02-27 1976-02-27

Country Status (1)

Country Link
JP (1) JPS5631874Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59218759A (ja) * 1983-05-27 1984-12-10 Toshiba Corp 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5250680Y2 (enrdf_load_stackoverflow) * 1972-06-22 1977-11-17

Also Published As

Publication number Publication date
JPS52116161U (enrdf_load_stackoverflow) 1977-09-03

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