JPS5631874Y2 - - Google Patents

Info

Publication number
JPS5631874Y2
JPS5631874Y2 JP1976023496U JP2349676U JPS5631874Y2 JP S5631874 Y2 JPS5631874 Y2 JP S5631874Y2 JP 1976023496 U JP1976023496 U JP 1976023496U JP 2349676 U JP2349676 U JP 2349676U JP S5631874 Y2 JPS5631874 Y2 JP S5631874Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976023496U
Other languages
Japanese (ja)
Other versions
JPS52116161U (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976023496U priority Critical patent/JPS5631874Y2/ja
Publication of JPS52116161U publication Critical patent/JPS52116161U/ja
Application granted granted Critical
Publication of JPS5631874Y2 publication Critical patent/JPS5631874Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1976023496U 1976-02-27 1976-02-27 Expired JPS5631874Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976023496U JPS5631874Y2 (cg-RX-API-DMAC7.html) 1976-02-27 1976-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976023496U JPS5631874Y2 (cg-RX-API-DMAC7.html) 1976-02-27 1976-02-27

Publications (2)

Publication Number Publication Date
JPS52116161U JPS52116161U (cg-RX-API-DMAC7.html) 1977-09-03
JPS5631874Y2 true JPS5631874Y2 (cg-RX-API-DMAC7.html) 1981-07-29

Family

ID=28483417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976023496U Expired JPS5631874Y2 (cg-RX-API-DMAC7.html) 1976-02-27 1976-02-27

Country Status (1)

Country Link
JP (1) JPS5631874Y2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59218759A (ja) * 1983-05-27 1984-12-10 Toshiba Corp 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5250680Y2 (cg-RX-API-DMAC7.html) * 1972-06-22 1977-11-17

Also Published As

Publication number Publication date
JPS52116161U (cg-RX-API-DMAC7.html) 1977-09-03

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