JPS5631536U - - Google Patents
Info
- Publication number
- JPS5631536U JPS5631536U JP11211979U JP11211979U JPS5631536U JP S5631536 U JPS5631536 U JP S5631536U JP 11211979 U JP11211979 U JP 11211979U JP 11211979 U JP11211979 U JP 11211979U JP S5631536 U JPS5631536 U JP S5631536U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11211979U JPS5631536U (cs) | 1979-08-15 | 1979-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11211979U JPS5631536U (cs) | 1979-08-15 | 1979-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5631536U true JPS5631536U (cs) | 1981-03-27 |
Family
ID=29344521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11211979U Pending JPS5631536U (cs) | 1979-08-15 | 1979-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5631536U (cs) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61136965A (ja) * | 1984-12-06 | 1986-06-24 | 京セラ株式会社 | 薄膜用セラミツク基板の製造方法 |
| JPH0297467A (ja) * | 1988-10-05 | 1990-04-10 | Hokuriku Electric Ind Co Ltd | セラミック薄板の製造方法 |
| JP2003069217A (ja) * | 2001-08-22 | 2003-03-07 | Kyocera Corp | 回路基板の製造方法 |
| JP2010030280A (ja) * | 2008-06-27 | 2010-02-12 | Kyocera Corp | セラミック基体、放熱基体および電子装置 |
| JP2011132081A (ja) * | 2009-12-25 | 2011-07-07 | Nichicon Corp | 正特性サーミスタの製造方法および正特性サーミスタの焼結体 |
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1979
- 1979-08-15 JP JP11211979U patent/JPS5631536U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61136965A (ja) * | 1984-12-06 | 1986-06-24 | 京セラ株式会社 | 薄膜用セラミツク基板の製造方法 |
| JPH0297467A (ja) * | 1988-10-05 | 1990-04-10 | Hokuriku Electric Ind Co Ltd | セラミック薄板の製造方法 |
| JP2003069217A (ja) * | 2001-08-22 | 2003-03-07 | Kyocera Corp | 回路基板の製造方法 |
| JP2010030280A (ja) * | 2008-06-27 | 2010-02-12 | Kyocera Corp | セラミック基体、放熱基体および電子装置 |
| JP2011132081A (ja) * | 2009-12-25 | 2011-07-07 | Nichicon Corp | 正特性サーミスタの製造方法および正特性サーミスタの焼結体 |