JPS5631004U - - Google Patents
Info
- Publication number
- JPS5631004U JPS5631004U JP11326579U JP11326579U JPS5631004U JP S5631004 U JPS5631004 U JP S5631004U JP 11326579 U JP11326579 U JP 11326579U JP 11326579 U JP11326579 U JP 11326579U JP S5631004 U JPS5631004 U JP S5631004U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11326579U JPS5631004U (ja) | 1979-08-16 | 1979-08-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11326579U JPS5631004U (ja) | 1979-08-16 | 1979-08-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5631004U true JPS5631004U (ja) | 1981-03-26 |
Family
ID=29345560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11326579U Pending JPS5631004U (ja) | 1979-08-16 | 1979-08-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5631004U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5879724A (ja) * | 1981-11-06 | 1983-05-13 | Michio Osada | 熱硬化性樹脂材料による半導体チップの樹脂封止方法 |
JPH06104301A (ja) * | 1992-09-18 | 1994-04-15 | Nitto Denko Corp | 半導体封止用樹脂タブレット及びその製造方法と半導体封止方法 |
-
1979
- 1979-08-16 JP JP11326579U patent/JPS5631004U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5879724A (ja) * | 1981-11-06 | 1983-05-13 | Michio Osada | 熱硬化性樹脂材料による半導体チップの樹脂封止方法 |
JPH06104301A (ja) * | 1992-09-18 | 1994-04-15 | Nitto Denko Corp | 半導体封止用樹脂タブレット及びその製造方法と半導体封止方法 |