JPS5630479A - Primer for polyamide - Google Patents

Primer for polyamide

Info

Publication number
JPS5630479A
JPS5630479A JP10664079A JP10664079A JPS5630479A JP S5630479 A JPS5630479 A JP S5630479A JP 10664079 A JP10664079 A JP 10664079A JP 10664079 A JP10664079 A JP 10664079A JP S5630479 A JPS5630479 A JP S5630479A
Authority
JP
Japan
Prior art keywords
pref
carboxyl
polymer
primer
contg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10664079A
Other languages
Japanese (ja)
Inventor
Yukio Nakada
Hideo Ishida
Kiyoshi Tsurusawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP10664079A priority Critical patent/JPS5630479A/en
Publication of JPS5630479A publication Critical patent/JPS5630479A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide a primer which is previously coated on a metal surface to bond a polyamide well, by a method wherein a bisphenol A type epoxy resin and a carboxyl gp. contg. diene polymer is dissolved in an org. solvent.
CONSTITUTION: There is provided a primer for a polyamide, consisting of 100 pts.wt. of a bisphenol A type epoxy resin (A) and 3W120pts.wt., pref. 5W70 pts.wt. of a carboxyl gp.-contg. diene polymer dissolved in an org. solvent (C). The resins (A) are uncured epoxy resins having a m.p. of 60W180°C, pref. 100W 165°C. The number of the carboxyl gp. of the polymer (B) is pref. 0.1W4 per molecule of the polymer. The number-average MW of the carboxyl gp.-contg. diene polymer is pref. 500W10,000. The examples of the solvents which dissolve the resin (A) and the polymer (B) are hydrocarbons, chlorinated hydrocarbons, ethers and alcohols. The sum of the concn. of (A) and (B) in a soln. is pref. 10W40wt%.
COPYRIGHT: (C)1981,JPO&Japio
JP10664079A 1979-08-23 1979-08-23 Primer for polyamide Pending JPS5630479A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10664079A JPS5630479A (en) 1979-08-23 1979-08-23 Primer for polyamide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10664079A JPS5630479A (en) 1979-08-23 1979-08-23 Primer for polyamide

Publications (1)

Publication Number Publication Date
JPS5630479A true JPS5630479A (en) 1981-03-27

Family

ID=14438708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10664079A Pending JPS5630479A (en) 1979-08-23 1979-08-23 Primer for polyamide

Country Status (1)

Country Link
JP (1) JPS5630479A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01238931A (en) * 1988-03-22 1989-09-25 Mitsubishi Plastics Ind Ltd Polyamide resin-metal laminate
US4908273A (en) * 1987-03-24 1990-03-13 Ciba-Geigy Corporation Multi-layer, heat-curable adhesive film
DE102007031349A1 (en) * 2007-07-05 2009-01-08 Bayerische Motoren Werke Aktiengesellschaft Hybrid component with adhesion-promoting coating and method for its production

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4908273A (en) * 1987-03-24 1990-03-13 Ciba-Geigy Corporation Multi-layer, heat-curable adhesive film
JPH01238931A (en) * 1988-03-22 1989-09-25 Mitsubishi Plastics Ind Ltd Polyamide resin-metal laminate
DE102007031349A1 (en) * 2007-07-05 2009-01-08 Bayerische Motoren Werke Aktiengesellschaft Hybrid component with adhesion-promoting coating and method for its production

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