JPS5629969Y2 - - Google Patents
Info
- Publication number
- JPS5629969Y2 JPS5629969Y2 JP1975155358U JP15535875U JPS5629969Y2 JP S5629969 Y2 JPS5629969 Y2 JP S5629969Y2 JP 1975155358 U JP1975155358 U JP 1975155358U JP 15535875 U JP15535875 U JP 15535875U JP S5629969 Y2 JPS5629969 Y2 JP S5629969Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975155358U JPS5629969Y2 (cg-RX-API-DMAC7.html) | 1975-11-14 | 1975-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975155358U JPS5629969Y2 (cg-RX-API-DMAC7.html) | 1975-11-14 | 1975-11-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5268171U JPS5268171U (cg-RX-API-DMAC7.html) | 1977-05-20 |
| JPS5629969Y2 true JPS5629969Y2 (cg-RX-API-DMAC7.html) | 1981-07-16 |
Family
ID=28634565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975155358U Expired JPS5629969Y2 (cg-RX-API-DMAC7.html) | 1975-11-14 | 1975-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5629969Y2 (cg-RX-API-DMAC7.html) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5117383B2 (cg-RX-API-DMAC7.html) * | 1972-06-22 | 1976-06-02 |
-
1975
- 1975-11-14 JP JP1975155358U patent/JPS5629969Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5268171U (cg-RX-API-DMAC7.html) | 1977-05-20 |