JPS5629305B2 - - Google Patents
Info
- Publication number
- JPS5629305B2 JPS5629305B2 JP7569178A JP7569178A JPS5629305B2 JP S5629305 B2 JPS5629305 B2 JP S5629305B2 JP 7569178 A JP7569178 A JP 7569178A JP 7569178 A JP7569178 A JP 7569178A JP S5629305 B2 JPS5629305 B2 JP S5629305B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7569178A JPS553064A (en) | 1978-06-22 | 1978-06-22 | Binary/decimal adder device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7569178A JPS553064A (en) | 1978-06-22 | 1978-06-22 | Binary/decimal adder device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS553064A JPS553064A (en) | 1980-01-10 |
| JPS5629305B2 true JPS5629305B2 (OSRAM) | 1981-07-07 |
Family
ID=13583472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7569178A Granted JPS553064A (en) | 1978-06-22 | 1978-06-22 | Binary/decimal adder device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS553064A (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7547847B2 (en) | 2006-09-19 | 2009-06-16 | Siemens Energy, Inc. | High thermal conductivity dielectric tape |
| US7553438B2 (en) | 2004-06-15 | 2009-06-30 | Siemens Energy, Inc. | Compression of resin impregnated insulating tapes |
| US7592045B2 (en) | 2004-06-15 | 2009-09-22 | Siemens Energy, Inc. | Seeding of HTC fillers to form dendritic structures |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4001570A (en) * | 1975-06-17 | 1977-01-04 | International Business Machines Corporation | Arithmetic unit for a digital data processor |
-
1978
- 1978-06-22 JP JP7569178A patent/JPS553064A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7553438B2 (en) | 2004-06-15 | 2009-06-30 | Siemens Energy, Inc. | Compression of resin impregnated insulating tapes |
| US7592045B2 (en) | 2004-06-15 | 2009-09-22 | Siemens Energy, Inc. | Seeding of HTC fillers to form dendritic structures |
| US7547847B2 (en) | 2006-09-19 | 2009-06-16 | Siemens Energy, Inc. | High thermal conductivity dielectric tape |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS553064A (en) | 1980-01-10 |