JPS5628784Y2 - - Google Patents

Info

Publication number
JPS5628784Y2
JPS5628784Y2 JP1973093339U JP9333973U JPS5628784Y2 JP S5628784 Y2 JPS5628784 Y2 JP S5628784Y2 JP 1973093339 U JP1973093339 U JP 1973093339U JP 9333973 U JP9333973 U JP 9333973U JP S5628784 Y2 JPS5628784 Y2 JP S5628784Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1973093339U
Other languages
Japanese (ja)
Other versions
JPS5038445U (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973093339U priority Critical patent/JPS5628784Y2/ja
Publication of JPS5038445U publication Critical patent/JPS5038445U/ja
Application granted granted Critical
Publication of JPS5628784Y2 publication Critical patent/JPS5628784Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68Shapes or dispositions thereof
    • H10W70/682Shapes or dispositions thereof comprising holes having chips therein
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/877Bump connectors and die-attach connectors

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1973093339U 1973-08-08 1973-08-08 Expired JPS5628784Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973093339U JPS5628784Y2 (https=) 1973-08-08 1973-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973093339U JPS5628784Y2 (https=) 1973-08-08 1973-08-08

Publications (2)

Publication Number Publication Date
JPS5038445U JPS5038445U (https=) 1975-04-21
JPS5628784Y2 true JPS5628784Y2 (https=) 1981-07-08

Family

ID=28285605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973093339U Expired JPS5628784Y2 (https=) 1973-08-08 1973-08-08

Country Status (1)

Country Link
JP (1) JPS5628784Y2 (https=)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS459296Y1 (https=) * 1967-01-09 1970-05-01
JPS459628Y1 (https=) * 1967-07-14 1970-05-06

Also Published As

Publication number Publication date
JPS5038445U (https=) 1975-04-21

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