JPS5628784Y2 - - Google Patents
Info
- Publication number
- JPS5628784Y2 JPS5628784Y2 JP1973093339U JP9333973U JPS5628784Y2 JP S5628784 Y2 JPS5628784 Y2 JP S5628784Y2 JP 1973093339 U JP1973093339 U JP 1973093339U JP 9333973 U JP9333973 U JP 9333973U JP S5628784 Y2 JPS5628784 Y2 JP S5628784Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973093339U JPS5628784Y2 (enExample) | 1973-08-08 | 1973-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973093339U JPS5628784Y2 (enExample) | 1973-08-08 | 1973-08-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5038445U JPS5038445U (enExample) | 1975-04-21 |
| JPS5628784Y2 true JPS5628784Y2 (enExample) | 1981-07-08 |
Family
ID=28285605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973093339U Expired JPS5628784Y2 (enExample) | 1973-08-08 | 1973-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5628784Y2 (enExample) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS459296Y1 (enExample) * | 1967-01-09 | 1970-05-01 | ||
| JPS459628Y1 (enExample) * | 1967-07-14 | 1970-05-06 |
-
1973
- 1973-08-08 JP JP1973093339U patent/JPS5628784Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5038445U (enExample) | 1975-04-21 |