JPS5625023B2 - - Google Patents
Info
- Publication number
- JPS5625023B2 JPS5625023B2 JP15044576A JP15044576A JPS5625023B2 JP S5625023 B2 JPS5625023 B2 JP S5625023B2 JP 15044576 A JP15044576 A JP 15044576A JP 15044576 A JP15044576 A JP 15044576A JP S5625023 B2 JPS5625023 B2 JP S5625023B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15044576A JPS5374365A (en) | 1976-12-15 | 1976-12-15 | Semiconductor ceramic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15044576A JPS5374365A (en) | 1976-12-15 | 1976-12-15 | Semiconductor ceramic package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5374365A JPS5374365A (en) | 1978-07-01 |
| JPS5625023B2 true JPS5625023B2 (en:Method) | 1981-06-10 |
Family
ID=15497080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15044576A Granted JPS5374365A (en) | 1976-12-15 | 1976-12-15 | Semiconductor ceramic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5374365A (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6355944A (ja) * | 1986-08-26 | 1988-03-10 | Matsushita Electric Works Ltd | チツプキヤリアの製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA972080A (en) * | 1971-08-16 | 1975-07-29 | Mallory (P. R.) And Co. | Heat spreader for beam leaded semiconductor devices |
| JPS5346061B2 (en:Method) * | 1972-09-14 | 1978-12-11 | ||
| JPS5227349Y2 (en:Method) * | 1973-07-02 | 1977-06-21 | ||
| JPS5034170A (en:Method) * | 1973-07-27 | 1975-04-02 | ||
| JPS5821431B2 (ja) * | 1974-04-24 | 1983-04-30 | 富士通株式会社 | ハンドウタイソウチ |
| JPS5145976A (ja) * | 1974-10-16 | 1976-04-19 | Nippon Electric Co | Handotaisochi |
| JPS6056300B2 (ja) * | 1976-05-31 | 1985-12-09 | 日本電気株式会社 | 半導体装置 |
-
1976
- 1976-12-15 JP JP15044576A patent/JPS5374365A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5374365A (en) | 1978-07-01 |