JPS5622432A - Etching mask holder - Google Patents
Etching mask holderInfo
- Publication number
- JPS5622432A JPS5622432A JP9780079A JP9780079A JPS5622432A JP S5622432 A JPS5622432 A JP S5622432A JP 9780079 A JP9780079 A JP 9780079A JP 9780079 A JP9780079 A JP 9780079A JP S5622432 A JPS5622432 A JP S5622432A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- holder
- contact area
- unevenness
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To eliminate unevenness in mask processing, by reducing a contact area between a holder and a mask nearly to the necessary minimum for holding the mask. CONSTITUTION:Holes are provided in part 2 contacting to a mask, in bottom 3, and ends 4 in single holder 1 made of polypropylene so as to reduce a contact area nearly to the limit for holding the mask, and in another case, holes are formed in sides 2 and ends 4 of holder 5 made of a fluorocarbon resin already fixed to a mask processing unit so as to reduce a contact area similarily. Use of a holder of such a structure and reduction of a mask contact area permits processing unevenness in developing and etching to be prevented and baking unevenness in a mask baking process also to be inhibited.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9780079A JPS5622432A (en) | 1979-07-31 | 1979-07-31 | Etching mask holder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9780079A JPS5622432A (en) | 1979-07-31 | 1979-07-31 | Etching mask holder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5622432A true JPS5622432A (en) | 1981-03-03 |
Family
ID=14201851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9780079A Pending JPS5622432A (en) | 1979-07-31 | 1979-07-31 | Etching mask holder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5622432A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0847777A (en) * | 1995-07-31 | 1996-02-20 | Komatsu Ltd | Plasma cutting machine |
-
1979
- 1979-07-31 JP JP9780079A patent/JPS5622432A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0847777A (en) * | 1995-07-31 | 1996-02-20 | Komatsu Ltd | Plasma cutting machine |
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