JPS5622157B2 - - Google Patents
Info
- Publication number
- JPS5622157B2 JPS5622157B2 JP12777876A JP12777876A JPS5622157B2 JP S5622157 B2 JPS5622157 B2 JP S5622157B2 JP 12777876 A JP12777876 A JP 12777876A JP 12777876 A JP12777876 A JP 12777876A JP S5622157 B2 JPS5622157 B2 JP S5622157B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12777876A JPS5353774A (en) | 1976-10-26 | 1976-10-26 | Method of producing printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12777876A JPS5353774A (en) | 1976-10-26 | 1976-10-26 | Method of producing printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5353774A JPS5353774A (en) | 1978-05-16 |
JPS5622157B2 true JPS5622157B2 (ja) | 1981-05-23 |
Family
ID=14968442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12777876A Granted JPS5353774A (en) | 1976-10-26 | 1976-10-26 | Method of producing printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5353774A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0632362B2 (ja) * | 1987-08-20 | 1994-04-27 | イビデン株式会社 | 導体回路を有するセラミック基板の製造方法 |
JP3223199B2 (ja) * | 1991-10-25 | 2001-10-29 | ティーディーケイ株式会社 | 多層セラミック部品の製造方法および多層セラミック部品 |
JP2858073B2 (ja) * | 1992-12-28 | 1999-02-17 | ティーディーケイ株式会社 | 多層セラミック部品 |
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1976
- 1976-10-26 JP JP12777876A patent/JPS5353774A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5353774A (en) | 1978-05-16 |