JPS5620116B2 - - Google Patents
Info
- Publication number
- JPS5620116B2 JPS5620116B2 JP4549977A JP4549977A JPS5620116B2 JP S5620116 B2 JPS5620116 B2 JP S5620116B2 JP 4549977 A JP4549977 A JP 4549977A JP 4549977 A JP4549977 A JP 4549977A JP S5620116 B2 JPS5620116 B2 JP S5620116B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4549977A JPS53130252A (en) | 1977-04-19 | 1977-04-19 | Solder material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4549977A JPS53130252A (en) | 1977-04-19 | 1977-04-19 | Solder material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53130252A JPS53130252A (en) | 1978-11-14 |
| JPS5620116B2 true JPS5620116B2 (ja) | 1981-05-12 |
Family
ID=12721086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4549977A Granted JPS53130252A (en) | 1977-04-19 | 1977-04-19 | Solder material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53130252A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60165599U (ja) * | 1984-04-09 | 1985-11-02 | 帝人株式会社 | アンカ−ボルト |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111872596A (zh) * | 2020-07-29 | 2020-11-03 | 昆山市宏嘉焊锡制造有限公司 | 一种铟、铅、银、锑低温钎焊料 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3734698A (en) * | 1970-09-18 | 1973-05-22 | Ppg Industries Inc | Transparent electroconductive window and electroconductive solder therefor |
-
1977
- 1977-04-19 JP JP4549977A patent/JPS53130252A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3734698A (en) * | 1970-09-18 | 1973-05-22 | Ppg Industries Inc | Transparent electroconductive window and electroconductive solder therefor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60165599U (ja) * | 1984-04-09 | 1985-11-02 | 帝人株式会社 | アンカ−ボルト |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53130252A (en) | 1978-11-14 |