JPS5619120B2 - - Google Patents
Info
- Publication number
- JPS5619120B2 JPS5619120B2 JP11172373A JP11172373A JPS5619120B2 JP S5619120 B2 JPS5619120 B2 JP S5619120B2 JP 11172373 A JP11172373 A JP 11172373A JP 11172373 A JP11172373 A JP 11172373A JP S5619120 B2 JPS5619120 B2 JP S5619120B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11172373A JPS5619120B2 (cs) | 1973-10-04 | 1973-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11172373A JPS5619120B2 (cs) | 1973-10-04 | 1973-10-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5061658A JPS5061658A (cs) | 1975-05-27 |
| JPS5619120B2 true JPS5619120B2 (cs) | 1981-05-06 |
Family
ID=14568517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11172373A Expired JPS5619120B2 (cs) | 1973-10-04 | 1973-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5619120B2 (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0222729U (cs) * | 1988-07-25 | 1990-02-15 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5133117Y2 (cs) * | 1971-02-18 | 1976-08-17 | ||
| JPS5441966Y2 (cs) * | 1973-05-01 | 1979-12-07 |
-
1973
- 1973-10-04 JP JP11172373A patent/JPS5619120B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0222729U (cs) * | 1988-07-25 | 1990-02-15 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5061658A (cs) | 1975-05-27 |