JPS5619043U - - Google Patents
Info
- Publication number
- JPS5619043U JPS5619043U JP1979101501U JP10150179U JPS5619043U JP S5619043 U JPS5619043 U JP S5619043U JP 1979101501 U JP1979101501 U JP 1979101501U JP 10150179 U JP10150179 U JP 10150179U JP S5619043 U JPS5619043 U JP S5619043U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979101501U JPS5619043U (ja) | 1979-07-23 | 1979-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979101501U JPS5619043U (ja) | 1979-07-23 | 1979-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5619043U true JPS5619043U (ja) | 1981-02-19 |
Family
ID=29334241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979101501U Pending JPS5619043U (ja) | 1979-07-23 | 1979-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5619043U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0289002A (ja) * | 1988-09-26 | 1990-03-29 | Zeniraito V:Kk | 筒状レンズおよび筒状レンズの製造法 |
-
1979
- 1979-07-23 JP JP1979101501U patent/JPS5619043U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0289002A (ja) * | 1988-09-26 | 1990-03-29 | Zeniraito V:Kk | 筒状レンズおよび筒状レンズの製造法 |