JPS5618447A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5618447A JPS5618447A JP9320779A JP9320779A JPS5618447A JP S5618447 A JPS5618447 A JP S5618447A JP 9320779 A JP9320779 A JP 9320779A JP 9320779 A JP9320779 A JP 9320779A JP S5618447 A JPS5618447 A JP S5618447A
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipating
- semiconductor device
- planar member
- dissipating plate
- reliability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9320779A JPS5618447A (en) | 1979-07-24 | 1979-07-24 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9320779A JPS5618447A (en) | 1979-07-24 | 1979-07-24 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5618447A true JPS5618447A (en) | 1981-02-21 |
Family
ID=14076114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9320779A Pending JPS5618447A (en) | 1979-07-24 | 1979-07-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5618447A (ja) |
-
1979
- 1979-07-24 JP JP9320779A patent/JPS5618447A/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5425581A (en) | Pallet transferring type processor | |
IL72652A (en) | Device for uniting sheet components | |
JPS52116050A (en) | Small size computer with graph display unit | |
JPS5618447A (en) | Semiconductor device | |
JPS5253690A (en) | Thickness sliding crystal vibrator | |
ES460167A1 (es) | Perfeccionamientos introducidos en distribuidores rotativos. | |
JPS52153647A (en) | Elastic surface wave element | |
IT1090896B (it) | Dispositivo di sicurezza per presse punzonatrici e simili | |
JPS5562742A (en) | Method of cutting monocrystal | |
JPS5358830A (en) | Menu displaying device of heating kitchen-range | |
JPS6463301A (en) | Attaching device for tillage tine | |
JPS5357009A (en) | Magnetic disc device | |
JPS5217278A (en) | Low noise cutter | |
JPS5380979A (en) | Semiconductor device | |
SU566659A1 (ru) | Устройство дл шамповки | |
JPS52143019A (en) | Developing agent for positive type radiation sensitive material | |
SU629300A2 (ru) | Железобетонна панель | |
JPS52111384A (en) | Flat semi-conductor heat dissipator | |
JPS53110470A (en) | Manufacture for semiconductor device | |
JPS5377367A (en) | Latch device for electronic range | |
JPS5418649A (en) | Portable-type electronic desk computer | |
JPS51146176A (en) | Basic plate for diode device | |
JPS5264288A (en) | Semiconductor laser device | |
JPS5396120A (en) | Structure for reinforcing pressed plate member | |
JPS5633865A (en) | Attachment of package |