JPS56174871U - - Google Patents
Info
- Publication number
- JPS56174871U JPS56174871U JP1980072907U JP7290780U JPS56174871U JP S56174871 U JPS56174871 U JP S56174871U JP 1980072907 U JP1980072907 U JP 1980072907U JP 7290780 U JP7290780 U JP 7290780U JP S56174871 U JPS56174871 U JP S56174871U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980072907U JPS62209Y2 (en:Method) | 1980-05-26 | 1980-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980072907U JPS62209Y2 (en:Method) | 1980-05-26 | 1980-05-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56174871U true JPS56174871U (en:Method) | 1981-12-23 |
| JPS62209Y2 JPS62209Y2 (en:Method) | 1987-01-07 |
Family
ID=29435927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980072907U Expired JPS62209Y2 (en:Method) | 1980-05-26 | 1980-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62209Y2 (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0444171U (en:Method) * | 1990-08-21 | 1992-04-15 | ||
| JP2005079578A (ja) * | 2003-08-28 | 2005-03-24 | Agilent Technol Inc | 熱伝導率を向上させた発光デバイス・アセンブリ、それを含むシステム及び熱伝導率を向上する方法 |
-
1980
- 1980-05-26 JP JP1980072907U patent/JPS62209Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0444171U (en:Method) * | 1990-08-21 | 1992-04-15 | ||
| JP2005079578A (ja) * | 2003-08-28 | 2005-03-24 | Agilent Technol Inc | 熱伝導率を向上させた発光デバイス・アセンブリ、それを含むシステム及び熱伝導率を向上する方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62209Y2 (en:Method) | 1987-01-07 |