JPS56174871U - - Google Patents

Info

Publication number
JPS56174871U
JPS56174871U JP1980072907U JP7290780U JPS56174871U JP S56174871 U JPS56174871 U JP S56174871U JP 1980072907 U JP1980072907 U JP 1980072907U JP 7290780 U JP7290780 U JP 7290780U JP S56174871 U JPS56174871 U JP S56174871U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980072907U
Other languages
Japanese (ja)
Other versions
JPS62209Y2 (Direct
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980072907U priority Critical patent/JPS62209Y2/ja
Publication of JPS56174871U publication Critical patent/JPS56174871U/ja
Application granted granted Critical
Publication of JPS62209Y2 publication Critical patent/JPS62209Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1980072907U 1980-05-26 1980-05-26 Expired JPS62209Y2 (Direct)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980072907U JPS62209Y2 (Direct) 1980-05-26 1980-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980072907U JPS62209Y2 (Direct) 1980-05-26 1980-05-26

Publications (2)

Publication Number Publication Date
JPS56174871U true JPS56174871U (Direct) 1981-12-23
JPS62209Y2 JPS62209Y2 (Direct) 1987-01-07

Family

ID=29435927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980072907U Expired JPS62209Y2 (Direct) 1980-05-26 1980-05-26

Country Status (1)

Country Link
JP (1) JPS62209Y2 (Direct)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0444171U (Direct) * 1990-08-21 1992-04-15
JP2005079578A (ja) * 2003-08-28 2005-03-24 Agilent Technol Inc 熱伝導率を向上させた発光デバイス・アセンブリ、それを含むシステム及び熱伝導率を向上する方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0444171U (Direct) * 1990-08-21 1992-04-15
JP2005079578A (ja) * 2003-08-28 2005-03-24 Agilent Technol Inc 熱伝導率を向上させた発光デバイス・アセンブリ、それを含むシステム及び熱伝導率を向上する方法

Also Published As

Publication number Publication date
JPS62209Y2 (Direct) 1987-01-07

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