JPS56172938U - - Google Patents
Info
- Publication number
- JPS56172938U JPS56172938U JP1980071677U JP7167780U JPS56172938U JP S56172938 U JPS56172938 U JP S56172938U JP 1980071677 U JP1980071677 U JP 1980071677U JP 7167780 U JP7167780 U JP 7167780U JP S56172938 U JPS56172938 U JP S56172938U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980071677U JPS56172938U (en) | 1980-05-23 | 1980-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980071677U JPS56172938U (en) | 1980-05-23 | 1980-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56172938U true JPS56172938U (en) | 1981-12-21 |
Family
ID=29665370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980071677U Pending JPS56172938U (en) | 1980-05-23 | 1980-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56172938U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018020640A1 (en) * | 2016-07-28 | 2018-02-01 | 三菱電機株式会社 | Semiconductor device |
| WO2023053901A1 (en) * | 2021-09-30 | 2023-04-06 | 株式会社タムラ製作所 | Bonding material and semiconductor package |
-
1980
- 1980-05-23 JP JP1980071677U patent/JPS56172938U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018020640A1 (en) * | 2016-07-28 | 2018-02-01 | 三菱電機株式会社 | Semiconductor device |
| JPWO2018020640A1 (en) * | 2016-07-28 | 2018-12-13 | 三菱電機株式会社 | Semiconductor device |
| DE112016007096B4 (en) | 2016-07-28 | 2023-06-29 | Mitsubishi Electric Corporation | semiconductor device |
| WO2023053901A1 (en) * | 2021-09-30 | 2023-04-06 | 株式会社タムラ製作所 | Bonding material and semiconductor package |